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臺(tái)積電董事長(zhǎng)發(fā)文:全球最大的芯片制造商如何重塑半導(dǎo)體行業(yè)

MARK LIU
2022-06-10

按照目前的速度,,到2030年,全球半導(dǎo)體年收入將超過1萬億美元,。

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臺(tái)積電(Taiwan Semiconductor Manufacturing Co.)董事長(zhǎng)劉德音(Mark Liu)表示,,5G、人工智能和物聯(lián)網(wǎng)的興起正在為“半導(dǎo)體行業(yè)的黃金時(shí)代”鋪平道路,。圖片來源:臺(tái)積電

半個(gè)多世紀(jì)以來,,半導(dǎo)體一直是技術(shù)創(chuàng)新的核心,技術(shù)的進(jìn)步與半導(dǎo)體性能,、能耗和成本的發(fā)展同步?,F(xiàn)在,隨著對(duì)高性能計(jì)算 (HPC) 以及5G和人工智能應(yīng)用的需求不斷增長(zhǎng),,技術(shù)進(jìn)步的需求猛增,,為半導(dǎo)體技術(shù)新構(gòu)想的未來鋪平了道路,未來可以讓無限的可能成為現(xiàn)實(shí)。

要了解這個(gè)未來,,就有必要回顧60年前的發(fā)明,,當(dāng)時(shí)人們發(fā)明了一種將許多晶體管集成在同一塊芯片上的方法——集成電路(IC)或微芯片。在隨后的幾年里,,半導(dǎo)體技術(shù)通過不斷的小型化而實(shí)現(xiàn)進(jìn)步,,正如摩爾定律所預(yù)測(cè)的那樣,集成電路上的晶體管數(shù)量每隔一年就會(huì)翻一番,,該定律以美國(guó)工程師戈登·摩爾(Gordon Moore)的名字命名,。這種持續(xù)的進(jìn)步使我們的手機(jī)擁有比1969年阿波羅11號(hào)登月時(shí)所運(yùn)用的70磅重的古老計(jì)算機(jī)更強(qiáng)大的計(jì)算能力。

從成本到普及再到價(jià)值

半導(dǎo)體技術(shù)和集成電路的一個(gè)關(guān)鍵屬性是不斷降低每個(gè)功能的成本,。隨著時(shí)間的推移,,這種持續(xù)的成本降低導(dǎo)致了半導(dǎo)體技術(shù)的普及。例如,,1970年,,美國(guó)電話電報(bào)公司(AT&T)首次將可視電話商業(yè)化,但由于成本高昂,,它的用戶不到500人,。

半導(dǎo)體技術(shù)的大規(guī)模成本降低得益于純晶圓代工廠模式的誕生,這種模式是臺(tái)積電在35年前成立時(shí)開創(chuàng)的,。在這種模式下,純晶圓代工廠經(jīng)營(yíng)的半導(dǎo)體制造廠專注于為其他公司生產(chǎn)集成電路,,而不是提供自己設(shè)計(jì)的集成電路產(chǎn)品,。由于集成電路生產(chǎn)設(shè)施的建造和維護(hù)成本高昂,而且可能會(huì)極大地消耗企業(yè)的資金,,因此將生產(chǎn)外包給代工廠可以讓企業(yè)將資源集中在最終產(chǎn)品上,。這使得無晶圓廠的生產(chǎn)外包(僅限于設(shè)計(jì))行業(yè)蓬勃發(fā)展,并有助于實(shí)現(xiàn)技術(shù)的大規(guī)模普及,,使遠(yuǎn)程工作,、在線學(xué)習(xí)、共享經(jīng)濟(jì)和娛樂流媒體成為如今的現(xiàn)實(shí),。

新冠肺炎疫情和隨之而來的封城成為技術(shù)創(chuàng)新的另一個(gè)轉(zhuǎn)折點(diǎn),,10年以上價(jià)值的數(shù)字化在一年之內(nèi)實(shí)現(xiàn),半導(dǎo)體需求也隨之增加,。據(jù)麥肯錫公司(McKinsey & Co.)預(yù)測(cè),,按照目前的速度,到2030年,,全球半導(dǎo)體年收入將超過1萬億美元,,對(duì)全球電子產(chǎn)品增長(zhǎng)的直接貢獻(xiàn)將達(dá)到3-4萬億美元。然而,持續(xù)降低成本導(dǎo)致了對(duì)半導(dǎo)體價(jià)值的低估,。正如最近半導(dǎo)體供應(yīng)鏈的挑戰(zhàn)所清楚地表明的那樣,,半導(dǎo)體無處不在,并在現(xiàn)代社會(huì)中發(fā)揮著重要作用,。

打開通往未來世界的大門

隨著計(jì)算設(shè)備變得無處不在,,在全球網(wǎng)絡(luò)中生成和通信的數(shù)據(jù)量(通常是實(shí)時(shí)的)呈指數(shù)級(jí)增長(zhǎng)。為了跟上這種增長(zhǎng),,高性能計(jì)算變得至關(guān)重要,,并且呈爆炸性增長(zhǎng)。高性能計(jì)算指的是以高速處理數(shù)據(jù)和執(zhí)行復(fù)雜計(jì)算以解決性能密集型問題的能力,。如今,,高性能計(jì)算已經(jīng)超越智能手機(jī)成為增長(zhǎng)的驅(qū)動(dòng)力。據(jù)Report Ocean的研究,,這是半導(dǎo)體行業(yè)增長(zhǎng)最快的領(lǐng)域之一,,預(yù)計(jì)到2027年,全球高性能計(jì)算芯片組市場(chǎng)規(guī)模將從2019年的43億美元增至136.8億美元,。

虛擬世界與物理世界的融合將給人們的互動(dòng)方式帶來翻天覆地的變化,,而高性能計(jì)算的應(yīng)用使之成為現(xiàn)實(shí)。除了大量由半導(dǎo)體制成的傳感器和執(zhí)行器之外,,虛擬世界和物理世界的這種集成還需要智能設(shè)備,、可穿戴設(shè)備、物聯(lián)網(wǎng)等硬件,,以及5G,、人工智能和大數(shù)據(jù)分析等用于通信、理解信息和決策的技術(shù),。對(duì)于每一種應(yīng)用,,半導(dǎo)體含量及其提供的價(jià)值都將迅速提高。

半導(dǎo)體將為越來越多的產(chǎn)品注入智能和新功能,,從而提高這些產(chǎn)品的價(jià)值,。例如,自動(dòng)駕駛汽車將通過先進(jìn)的芯片變得更加安全和節(jié)能,,這些芯片允許執(zhí)行復(fù)雜的軟件功能和分析,。根據(jù)這一預(yù)期的自動(dòng)駕駛汽車能源效率,德克薩斯大學(xué)的研究估計(jì),,與美國(guó)目前的地面交通條件相比,,凈能源將減少 11% 至 55%。社會(huì)也期待能夠出現(xiàn)超出我們想象的新的用戶應(yīng)用程序,。半導(dǎo)體提供的計(jì)算能力將推動(dòng)個(gè)性化和社區(qū)醫(yī)療以及疫苗和藥物的研發(fā),。打擊社交媒體上的虛假信息需要更好的算法和計(jì)算能力來訓(xùn)練人工智能模型,。

例如,用于創(chuàng)建真實(shí)的堪比人類質(zhì)量文本的最先進(jìn)的人工智能語言模型之一GPT-3需要300 zetta-FLOPS (一種衡量超級(jí)計(jì)算機(jī)性能的指標(biāo))才能在高性能計(jì)算云上進(jìn)行訓(xùn)練,。作為回報(bào),,這種人工智能語言模型所實(shí)現(xiàn)的能力也會(huì)令人印象深刻。最近,,《紐約時(shí)報(bào)》的科技專欄作家凱文·盧斯(Kevin Roose)用GPT-3完成了一篇書評(píng),。

人工智能通常被認(rèn)為是一種主要涉及軟件和算法的技術(shù)。然而,,硬件技術(shù)打開了通往虛擬世界的大門,,讓我們能夠使用從人工智能中獲得的信息。因此,,即使在元宇宙中,,實(shí)體也占據(jù)了中心位置。

共有的樂觀精神

隨著半導(dǎo)體技術(shù)的不斷進(jìn)步,,滿足了5G和人工智能時(shí)代的發(fā)展需求,,能源效率已成為最重要的衡量標(biāo)準(zhǔn),不僅因?yàn)橛?jì)算能力已經(jīng)因無法散熱而受到限制,,還因?yàn)槿蛴?jì)算能源使用的升級(jí)速度比任何其他應(yīng)用領(lǐng)域都快,。單是半導(dǎo)體技術(shù)帶來的計(jì)算能源效率就在以飛快的速度提高——每?jī)赡晏岣邇杀丁藗兤毡闃酚^地認(rèn)為,技術(shù)將像過去50年那樣繼續(xù)像上了發(fā)條一樣快速發(fā)展,。

這種經(jīng)常與摩爾定律混為一談的共有的樂觀精神也許比“定律”本身更重要,。正是這個(gè)行業(yè)和整個(gè)社會(huì)所共有的樂觀精神,推動(dòng)該行業(yè)直面挑戰(zhàn),,并使預(yù)測(cè)成為自我應(yīng)驗(yàn)的預(yù)測(cè),。

在未來的50年里,未來一代可能會(huì)使用虛擬現(xiàn)實(shí)和增強(qiáng)現(xiàn)實(shí)(VR/AR)作為他們與世界互動(dòng)的主要方式,。如今的VR/AR頭顯平均重量超過一磅,電池續(xù)航時(shí)間不到兩三個(gè)小時(shí),,而且價(jià)格昂貴,,這讓我們想起了25年前的手機(jī)。要達(dá)到如今手機(jī)的普及程度,,VR/AR設(shè)備還需要提高100倍以上,。這只能通過半導(dǎo)體技術(shù)的不斷進(jìn)步來實(shí)現(xiàn)。

未來幾十年將是半導(dǎo)體產(chǎn)業(yè)的黃金時(shí)代,。在過去的50年里,,半導(dǎo)體技術(shù)的發(fā)展就像在隧道里行走一樣。前進(jìn)的道路很明確,,因?yàn)槊總€(gè)人都努力沿著一條明確的道路前進(jìn),,那就是縮小晶體管?,F(xiàn)在我們正在接近隧道的出口。隧道之外還有更多的可能性:從材料到架構(gòu)的創(chuàng)新使新的發(fā)展路徑成為可能,,新的應(yīng)用程序也明確了新的方向,。我們不再受隧道的限制,如今,,我們擁有無限的創(chuàng)新空間,。(財(cái)富中文網(wǎng))

劉德音是臺(tái)積電董事長(zhǎng)。

譯者:中慧言-王芳

半個(gè)多世紀(jì)以來,,半導(dǎo)體一直是技術(shù)創(chuàng)新的核心,,技術(shù)的進(jìn)步與半導(dǎo)體性能、能耗和成本的發(fā)展同步?,F(xiàn)在,,隨著對(duì)高性能計(jì)算 (HPC) 以及5G和人工智能應(yīng)用的需求不斷增長(zhǎng),技術(shù)進(jìn)步的需求猛增,,為半導(dǎo)體技術(shù)新構(gòu)想的未來鋪平了道路,,未來可以讓無限的可能成為現(xiàn)實(shí)。

要了解這個(gè)未來,,就有必要回顧60年前的發(fā)明,,當(dāng)時(shí)人們發(fā)明了一種將許多晶體管集成在同一塊芯片上的方法——集成電路(IC)或微芯片。在隨后的幾年里,,半導(dǎo)體技術(shù)通過不斷的小型化而實(shí)現(xiàn)進(jìn)步,,正如摩爾定律所預(yù)測(cè)的那樣,集成電路上的晶體管數(shù)量每隔一年就會(huì)翻一番,,該定律以美國(guó)工程師戈登·摩爾(Gordon Moore)的名字命名,。這種持續(xù)的進(jìn)步使我們的手機(jī)擁有比1969年阿波羅11號(hào)登月時(shí)所運(yùn)用的70磅重的古老計(jì)算機(jī)更強(qiáng)大的計(jì)算能力。

從成本到普及再到價(jià)值

半導(dǎo)體技術(shù)和集成電路的一個(gè)關(guān)鍵屬性是不斷降低每個(gè)功能的成本,。隨著時(shí)間的推移,,這種持續(xù)的成本降低導(dǎo)致了半導(dǎo)體技術(shù)的普及。例如,,1970年,,美國(guó)電話電報(bào)公司(AT&T)首次將可視電話商業(yè)化,但由于成本高昂,,它的用戶不到500人,。

半導(dǎo)體技術(shù)的大規(guī)模成本降低得益于純晶圓代工廠模式的誕生,這種模式是臺(tái)積電在35年前成立時(shí)開創(chuàng)的,。在這種模式下,,純晶圓代工廠經(jīng)營(yíng)的半導(dǎo)體制造廠專注于為其他公司生產(chǎn)集成電路,而不是提供自己設(shè)計(jì)的集成電路產(chǎn)品,。由于集成電路生產(chǎn)設(shè)施的建造和維護(hù)成本高昂,,而且可能會(huì)極大地消耗企業(yè)的資金,,因此將生產(chǎn)外包給代工廠可以讓企業(yè)將資源集中在最終產(chǎn)品上。這使得無晶圓廠的生產(chǎn)外包(僅限于設(shè)計(jì))行業(yè)蓬勃發(fā)展,,并有助于實(shí)現(xiàn)技術(shù)的大規(guī)模普及,,使遠(yuǎn)程工作、在線學(xué)習(xí),、共享經(jīng)濟(jì)和娛樂流媒體成為如今的現(xiàn)實(shí),。

新冠肺炎疫情和隨之而來的封城成為技術(shù)創(chuàng)新的另一個(gè)轉(zhuǎn)折點(diǎn),10年以上價(jià)值的數(shù)字化在一年之內(nèi)實(shí)現(xiàn),,半導(dǎo)體需求也隨之增加,。據(jù)麥肯錫公司(McKinsey & Co.)預(yù)測(cè),按照目前的速度,,到2030年,,全球半導(dǎo)體年收入將超過1萬億美元,對(duì)全球電子產(chǎn)品增長(zhǎng)的直接貢獻(xiàn)將達(dá)到3-4萬億美元,。然而,,持續(xù)降低成本導(dǎo)致了對(duì)半導(dǎo)體價(jià)值的低估。正如最近半導(dǎo)體供應(yīng)鏈的挑戰(zhàn)所清楚地表明的那樣,,半導(dǎo)體無處不在,,并在現(xiàn)代社會(huì)中發(fā)揮著重要作用。

打開通往未來世界的大門

隨著計(jì)算設(shè)備變得無處不在,,在全球網(wǎng)絡(luò)中生成和通信的數(shù)據(jù)量(通常是實(shí)時(shí)的)呈指數(shù)級(jí)增長(zhǎng),。為了跟上這種增長(zhǎng),高性能計(jì)算變得至關(guān)重要,,并且呈爆炸性增長(zhǎng),。高性能計(jì)算指的是以高速處理數(shù)據(jù)和執(zhí)行復(fù)雜計(jì)算以解決性能密集型問題的能力。如今,,高性能計(jì)算已經(jīng)超越智能手機(jī)成為增長(zhǎng)的驅(qū)動(dòng)力,。據(jù)Report Ocean的研究,這是半導(dǎo)體行業(yè)增長(zhǎng)最快的領(lǐng)域之一,,預(yù)計(jì)到2027年,,全球高性能計(jì)算芯片組市場(chǎng)規(guī)模將從2019年的43億美元增至136.8億美元。

虛擬世界與物理世界的融合將給人們的互動(dòng)方式帶來翻天覆地的變化,,而高性能計(jì)算的應(yīng)用使之成為現(xiàn)實(shí),。除了大量由半導(dǎo)體制成的傳感器和執(zhí)行器之外,,虛擬世界和物理世界的這種集成還需要智能設(shè)備,、可穿戴設(shè)備、物聯(lián)網(wǎng)等硬件,,以及5G,、人工智能和大數(shù)據(jù)分析等用于通信,、理解信息和決策的技術(shù)。對(duì)于每一種應(yīng)用,,半導(dǎo)體含量及其提供的價(jià)值都將迅速提高,。

半導(dǎo)體將為越來越多的產(chǎn)品注入智能和新功能,從而提高這些產(chǎn)品的價(jià)值,。例如,,自動(dòng)駕駛汽車將通過先進(jìn)的芯片變得更加安全和節(jié)能,這些芯片允許執(zhí)行復(fù)雜的軟件功能和分析,。根據(jù)這一預(yù)期的自動(dòng)駕駛汽車能源效率,,德克薩斯大學(xué)的研究估計(jì),與美國(guó)目前的地面交通條件相比,,凈能源將減少 11% 至 55%,。社會(huì)也期待能夠出現(xiàn)超出我們想象的新的用戶應(yīng)用程序。半導(dǎo)體提供的計(jì)算能力將推動(dòng)個(gè)性化和社區(qū)醫(yī)療以及疫苗和藥物的研發(fā),。打擊社交媒體上的虛假信息需要更好的算法和計(jì)算能力來訓(xùn)練人工智能模型,。

例如,用于創(chuàng)建真實(shí)的堪比人類質(zhì)量文本的最先進(jìn)的人工智能語言模型之一GPT-3需要300 zetta-FLOPS (一種衡量超級(jí)計(jì)算機(jī)性能的指標(biāo))才能在高性能計(jì)算云上進(jìn)行訓(xùn)練,。作為回報(bào),,這種人工智能語言模型所實(shí)現(xiàn)的能力也會(huì)令人印象深刻。最近,,《紐約時(shí)報(bào)》的科技專欄作家凱文·盧斯(Kevin Roose)用GPT-3完成了一篇書評(píng),。

人工智能通常被認(rèn)為是一種主要涉及軟件和算法的技術(shù)。然而,,硬件技術(shù)打開了通往虛擬世界的大門,,讓我們能夠使用從人工智能中獲得的信息。因此,,即使在元宇宙中,,實(shí)體也占據(jù)了中心位置。

共有的樂觀精神

隨著半導(dǎo)體技術(shù)的不斷進(jìn)步,,滿足了5G和人工智能時(shí)代的發(fā)展需求,,能源效率已成為最重要的衡量標(biāo)準(zhǔn),不僅因?yàn)橛?jì)算能力已經(jīng)因無法散熱而受到限制,,還因?yàn)槿蛴?jì)算能源使用的升級(jí)速度比任何其他應(yīng)用領(lǐng)域都快,。單是半導(dǎo)體技術(shù)帶來的計(jì)算能源效率就在以飛快的速度提高——每?jī)赡晏岣邇杀丁藗兤毡闃酚^地認(rèn)為,技術(shù)將像過去50年那樣繼續(xù)像上了發(fā)條一樣快速發(fā)展,。

這種經(jīng)常與摩爾定律混為一談的共有的樂觀精神也許比“定律”本身更重要,。正是這個(gè)行業(yè)和整個(gè)社會(huì)所共有的樂觀精神,推動(dòng)該行業(yè)直面挑戰(zhàn),,并使預(yù)測(cè)成為自我應(yīng)驗(yàn)的預(yù)測(cè),。

在未來的50年里,,未來一代可能會(huì)使用虛擬現(xiàn)實(shí)和增強(qiáng)現(xiàn)實(shí)(VR/AR)作為他們與世界互動(dòng)的主要方式。如今的VR/AR頭顯平均重量超過一磅,,電池續(xù)航時(shí)間不到兩三個(gè)小時(shí),,而且價(jià)格昂貴,這讓我們想起了25年前的手機(jī),。要達(dá)到如今手機(jī)的普及程度,,VR/AR設(shè)備還需要提高100倍以上。這只能通過半導(dǎo)體技術(shù)的不斷進(jìn)步來實(shí)現(xiàn),。

未來幾十年將是半導(dǎo)體產(chǎn)業(yè)的黃金時(shí)代,。在過去的50年里,半導(dǎo)體技術(shù)的發(fā)展就像在隧道里行走一樣,。前進(jìn)的道路很明確,,因?yàn)槊總€(gè)人都努力沿著一條明確的道路前進(jìn),那就是縮小晶體管?,F(xiàn)在我們正在接近隧道的出口,。隧道之外還有更多的可能性:從材料到架構(gòu)的創(chuàng)新使新的發(fā)展路徑成為可能,新的應(yīng)用程序也明確了新的方向,。我們不再受隧道的限制,,如今,我們擁有無限的創(chuàng)新空間,。(財(cái)富中文網(wǎng))

劉德音是臺(tái)積電董事長(zhǎng),。

譯者:中慧言-王芳

For over half a century, semiconductors have been at the heart of technological innovation, with advancements in technology marching to the cadence of developments in semiconductor performance, energy consumption, and cost. Now, with the ever-growing demand for high-performance computing (HPC), as well as 5G and A.I. applications, the need for technological advancement has skyrocketed, paving the way for a newly imagined future for semiconductor technology, where infinite possibilities can be realized.

To understand this future, it makes sense to look back 60 years in the past, to the invention of a way to put many transistors together on the same chip—the integrated circuit (IC) or microchip. Throughout the years that followed, semiconductor technology advanced through continuous miniaturization, which involved doubling the number of transistors on an integrated circuit every other year as predicted by Moore’s law, named after American engineer Gordon Moore. This continued advancement is what allows our mobile phones to have far more compute power than the now ancient 70-pound computer that landed Apollo 11 on the moon in 1969.

From cost to ubiquity to value

A key attribute of semiconductor technology and the integrated circuit has been relentless reduction of cost per function. This continuous cost reduction led to ubiquitous deployment of semiconductor technologies over time. The picture-phone, for instance, was first commercialized in 1970 by AT&T, but because of its high cost, it had fewer than 500 customers.

Large-scale cost reduction of semiconductor technology was helped along by the birth of the pure-play foundry model, pioneered by TSMC at its establishment 35 years ago. In this model, pure-play foundries operate semiconductor fabrication plants focused on producing ICs for other companies instead of offering IC products of their own design. As IC production facilities are expensive to build and maintain, and can be a huge drain on finances for companies, outsourcing this production to foundries allowed companies to focus their resources on their end product. This allowed the fabless (design only) industry to flourish and helped enable the large-scale ubiquitous deployment of the technologies that make remote working, online learning, the sharing economy, and entertainment streaming a reality today.

COVID-19 and the lockdowns it brought along with it became another turning point for technology innovation with more than 10 years’ worth of digitization happening over a single year, increasing the demand for semiconductors. At the current pace, annual global semiconductor revenue will grow to more than $1 trillion by 2030, directly contributing to $3 trillion to $4 trillion of global electronics growth, according to McKinsey & Co. Yet, the promise of continuous cost reduction has created an expectation that underestimates the value of semiconductors. As the recent semiconductor supply-chain challenge so clearly illustrates, semiconductors are everywhere and fulfill a valuable and vital role in modern society.

Opening doors to a future world

As computing devices become ubiquitous, the amount of data generated and communicated across a global network, often in real time, has grown exponentially. To keep up with this growth, high-performance computing (HPC) has become crucial and is seeing explosive growth. HPC is the ability to process data and perform complex calculations at high speeds to solve performance-intensive problems. Today, HPC has already surpassed the smartphone as a growth driver. It is one of the fastest growing segments of the semiconductor industry, with the global HPC chipset market size expected to reach $13.68 billion by 2027 from $4.30 billion in 2019, according to research from Report Ocean.

The integration of the virtual with the physical world will bring about a sea change in the way society interacts with one another and will be enabled by HPC applications. In addition to the multitude of sensors and actuators made of semiconductors, this integration of the virtual and the physical worlds requires hardware like smart appliances, wearable devices, IoT, and technologies like 5G, A.I., and big-data analytics for communicating, understanding information, and decision-making. For each of these applications, the semiconductor content, and the value it provides, will increase rapidly.

Semiconductors will imbue intelligence and new functionalities into more and more products, elevating the value of such products. For example, autonomous driving vehicles will become even safer and more energy efficient with advanced chips which allow for the execution of complex software functionalities and analytics. University of Texas research estimates a net energy reduction of 11% to 55% versus the current ground transportation conditions in the U.S., based off this expected autonomous vehicle energy efficiency. Society is also expecting new user applications beyond what we can imagine today. Personalized and community medicine as well as vaccine and drug discovery will get a boost from the computing power provided by semiconductors. Combating disinformation on social media will need better algorithms and computing power for training A.I. models.

As an example, one of the most advanced A.I. language models for creating realistic human-quality text, the GPT-3, requires 300 zetta-FLOPS (a measure of supercomputer performance) to train on a high-performance compute cloud. In return, the capability enabled by this A.I. language model can be impressive. GPT-3 recently was used by Kevin Roose, a tech columnist for the New York Times, to complete a book review.

A.I. is often thought of as a technology involving primarily software and algorithms. Yet, hardware technology is what opens the door to the virtual world and allows us to use the information derived from A.I. Thus, even in the metaverse, the physical takes center stage.

A shared optimism

As semiconductor technology advances to meet the needs of the 5G and A.I. era, energy efficiency has become the most important metric not only because computing power is already throttled by the inability to remove heat, but also because the global energy use of computing escalates faster than any other application area. Energy efficiency of computing due to semiconductor technology alone has been advancing at a rapid pace—2X every two years—and there is shared optimism that technology will continue to advance like clockwork as it did over the past 50 years.

This shared optimism that is often conflated with Moore’s law is perhaps more important than the “l(fā)aw” itself. It is this shared optimism by the industry and society at large, that has propelled the industry to meet the challenge and make the prophecy a self-fulfilling one.

In the next 50 years, the future generation will likely use virtual- and augmented-reality (VR/AR) as their principal means of interaction with the world. Today’s average VR/AR headsets weigh well over a pound, with a battery life of less than two to three hours, and a high price tag, which reminds us of the cell phones of 25 years ago. To achieve the same level of ubiquity as today’s cell phones, VR/AR devices will need to improve by more than 100 times. This can only be done with continuous advancement of semiconductor technology.

The upcoming decades will be a golden era for the semiconductor industry. Over the past 50 years, the development of semiconductor technology has been akin to walking inside a tunnel. The way ahead was clear as there was a well-defined path that everyone diligently followed—shrinking the transistor. Now we are approaching the exit of the tunnel. There are many more possibilities outside the tunnel: new paths made possible by innovations from materials to architecture and new destinations defined by new applications. We are no longer bound by the confines of the tunnel, and we now have unlimited room for unleashed innovation.

Mark Liu is the chairman of TSMC.

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